Product description
It has been formulated for the application to protect structure model of photo device. It can cure fast at low temperature.。
Features
Single component；
Low moisture absorption rate, high Tg；
Good adhesion on plastic materials.
Technical parameters
- Typical Uncured Properties
- Appearance
- Viscosity @25°C
- Thixotropic Index
- Work Life@25°C
- Storage Life@-40°C
- EXBOND 4000I
- Black paste with single component
- 2W+CP
- >2
- >24hours
- 1year
- Test Description
-
- Brookfield CP51@5rpm, 25℃
- Viscosity@0.5rpm/Viscosity@5rpm
- 25% increase in viscosity @ 25℃
- Storage Life@-40°C
- Cure process Data
- Recommend Cure condition
- EXBOND 4000I
- 30 min@100℃，detail please refer to Cure Temperature-Time Profile
- Physiochemical Properties-Post Cure
- Glass Transition Temperature(Tg)
- Coefficient of Thermal Expansion
- Die Shear Strength 25oC
- EXBOND 4000I
- 100℃
- Tg Below Tg 29 ppm/℃
Tg Above Tg 101 ppm/℃ - 25℃ 10 kgf/die
- Test Description
- TMA penetration mode
- TMA expansion mode
- 2mm×2mm Silicon Die，Ag/Cu Leadframe，25℃
The data above indicate typical values only and are not intended to be used as specification limits.Bonotec products are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Bonotec Standard Package Data Set or consult your Customer Service Representative.
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